STMicroelectronics, a global semiconductor company, is strengthening its attack on the home appliance market with the launch of a new 1,600V IGBT product.

ST has launched a new IGBT, the STGWA30IH160DF2, with 1,600V breakdown voltage and excellent thermal characteristics.

This device is aimed at the high-power home appliance market and is more competitive in terms of cost and energy efficiency.

STGWA30IH160DF2 has a maximum junction temperature of 175℃ and low thermal resistance to minimize heat generation, while supporting a rated current of 30A.

It boasts optimized performance for various kitchen appliances such as induction heaters, microwave ovens, and electric rice cookers that are subject to high heat stress.

This product is the first 1,600V IGBT of the IH2 generation in the STPOWER portfolio and applies the state-of-the-art Trench Gate Field-Stop (TGFS) technology.

This technology dramatically reduces conduction losses with high breakdown voltage and low saturation voltage as low as 1.77 V (VCEsat). It also minimizes tail current to lower turn-off energy and maximizes efficiency during switching.

Anti-parallel diodes provide low forward voltage and smooth reverse recovery characteristics, enabling optimal performance even in resonant and soft switching topologies.

Single-switch quasi-resonant converter design is possible over a wide switching frequency range from 16 kHz to 60 kHz.

Its high breakdown voltage and robust thermal efficiency allow it to reliably handle large voltage surges and spikes.

By reducing external protective components, the bill of materials (BOM) can be reduced and design complexity can be reduced.

The STGWA30IH160DF2 is available in a TO-247 long lead package, priced starting at $1.98 in quantities of 1,000 pieces.

It has a tight parameter distribution and a positive VCE(sat) temperature coefficient, making it easy to share current when connected in parallel.

“The STGWA30IH160DF2 will be the optimal solution for home appliance designers who are sensitive to cost and energy efficiency,” said an ST official. “It will significantly enhance market competitiveness by simultaneously improving efficiency and reducing component costs.”