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SK Hynix Develops and Mass-Produces 'HBM4', Breaking Through the Limits of AI Technology

기사입력2025.09.12 09:31


▲SK Hynix officially announced the establishment of the world's first mass production system for HBM4.

Advanced MR-MUF process and 10nm-class 5th-generation DRAM technology applied

SK Hynix has overcome the technological limitations of the AI era by developing and mass producing 'HBM4,' an ultra-high-performance AI memory.

SK Hynix announced on the 12th that it has completed the development of 'HBM4' for the first time in the world and officially established a mass production system.

This is considered a symbolic achievement that once again demonstrates technological leadership in the global semiconductor market.

HBM (High Bandwidth Memory) is a high-performance memory that vertically connects multiple DRAMs to achieve a breakthrough data processing speed compared to conventional DRAMs.

With the development of HBM4, SK Hynix has ushered in the era of 6th-generation HBM products, marking a technological turning point that will overcome the limitations of AI infrastructure.

HBM4 has doubled the bandwidth compared to the previous generation by applying 2,048 data transmission channels (I/O), and power efficiency has improved by more than 40%.

In particular, it is expected that AI service performance can be increased by up to 69% when introduced to customer systems, thereby solving data bottlenecks and contributing to reducing power costs in data centers.

Additionally, HBM4 can achieve a data rate of over 10 Gbps, which is higher than the 8 Gbps standard of the Joint Electron Device Engineering Council (JEDEC).It has achieved world-class performance by implementing the fastest speed.

SK Hynix has maximized production stability by applying its own advanced MR-MUF process and 10nm-class 5th generation (1 billion mn) DRAM technology to this mass production.

The MR-MUF process is effective in protecting circuits between chips and dissipating heat, and is evaluated as a key technology that minimizes mass production risks through warpage control.

SK Hynix AI Infra President Kim Joo-sun said, “HBM4 is a key product that will solve the technological challenges of the AI era,” and added, “We will grow into a full-stack AI memory provider by supplying the highest quality, diverse performance memory in a timely manner.”