The Electronics and Telecommunications Research Institute (ETRI) has developed ultra-fine bonding technology to realize 2,500 PPI-class Micro LED displays for AI and XR devices. The research team implemented a process connecting approximately 920,000 bumps at a 10 µm pitch, securing ultra-high-density bonding technology superior to that of HBM4. This achievement won the 'People's Choice Award' in the Micro LED category at SID Display Week 2026.

ETRI announced that it unveiled its SITRAB-based MicroLED display technology at 'SID Display Week 2026,' recently held in Los Angeles, USA. According to official SID data, ETRI's 'SITRAB-based MicroLED Display' was included in the list of winners for this year's People's Choice Award in the MicroLED-based technology category.

This technology targets LEDOS (Light Emitting Diode on Silicon) displays that directly combine micro LEDs on silicon CMOS circuits. LEDOS is attracting attention as an ultra-compact, ultra-high-resolution display technology required for XR devices that display images close to the eyes, such as AR glasses and VR headsets.

The key is the ultra-precision laser bonding process. ETRI researchers bonded gallium nitride (GaN)-based micro LED chips onto silicon circuits using SITRAB, a material developed in-house. Through this, they secured a high-density connection process necessary for realizing an ultra-high-resolution LEDOS of 2500 PPI.

In existing ultra-fine bonding processes, substrate deformation due to high-temperature treatment, alignment errors, and the generation of fine contaminants have been cited as major challenges. ETRI explains that SITRAB can reduce fume generation during laser processing and enable room-temperature stage-based processing, thereby lowering errors caused by thermal expansion.

This achievement suggests the potential for expansion not only into displays but also into the field of advanced semiconductor packaging. ETRI announced that SITRAB material technology has been transferred to domestic companies, and related process equipment is being verified on semiconductor back-end production lines.

The related research was published in the international academic journal 'Microsystems & Nanoengineering' last May. ETRI plans to continue developing technologies for RGB full-color implementation, ultra-low power driving, and large-area fabrication, and expand cooperation with domestic materials, equipment, and packaging companies.