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Dassault Systèmes-Cadence accelerate development of virtual twins for electromechanical systems

Google 우선 소스 기사입력2024.02.20 17:03


Dassault Systèmes 3D Experience Solidworks
Cadence AI-powered OrCAD X and Allegro X combination

Dassault Systèmes and Cadence partner to simplify the product development process.

Dassault Systèmes announced at 3DEXPERIENCE World 2024 in Dallas, USA on the 20th that it will continue to expand its strategic partnership with Cadence Design Systems, Inc. by integrating AI-based Cadence® OrCAD® X and Allegro® X with Dassault Systèmes 3DEXPERIENCE Works for existing and future customers using Cadence and SolidWorks.

This collaboration will enable industry-leading collaboration for continuous development across PCB, 3D mechanical design and simulation. AI-driven, cloud-based integration will provide mutual customers with an easy-to-use, end-to-end solution for next-generation product development, helping to reduce design time by up to 5x.

This integration provides a highly collaborative experience for electrical and mechanical engineers to accelerate the end-to-end mechatronics system development process while optimizing designs for performance, reliability, manufacturability, supply resiliency, regulatory compliance, and cost reduction. It also provides a seamless and scalable experience to customers of all sizes, from startups to large enterprises.

“Every company developing electromechanical products today needs synergistic solutions to avoid delays in getting to market,” said Kimball Cluff, vice president of software sales, GoEngineer, which provides mechanical and electrical design analysis solutions from Dassault Systèmes and Cadence. “The new cloud-based solution from Dassault Systèmes and Cadence provides electrical and mechanical design teams with a proven, easy-to-deploy collaborative solution with a desirable customer experience.”

“Every industry is experiencing an explosion of product complexity driven by electrification, AI/ML, security, connectivity and sustainability requirements,” said Tom Beckley, Cadence Senior Vice President. “Cadence is a leader in the development of AI tools for advanced IC packaging and PCB design, and now customers can design with Dassault Systèmes’ powerful 3DEXPERIENCE platform, leveraging industry-leading solutions that support collaboration across PCB and 3D mechanical design.”

“Today’s experience economy, where the value of a product comes from the experience of using it, is driving a rapid increase in demand for electromechanical products that evolve continuously. Companies are shifting to experiential thinking in their product development processes,” said Philippe Laufer, SVP Global Brands, Dassault Systèmes. “Through our partnership with Cadence, which is rapidly evolving, Dassault Systèmes will help customers make this transition easier.”