텍사스 인스트루먼트(이하 TI)는 위성 아키텍처용으로 설계된 업계 최초의 단일 칩 레이더 센서와 고집적, 소프트웨어 프로그래밍 가능 드라이버 칩 2종을 발표했다.
Single-chip radar sensor improves vehicle detection range by over 200m and enables accurate ADAS decision-making
New driver chip efficiently controls power flow in battery management and other powertrain systems Texas Instruments (TI) today announced the industry’s first single-chip radar sensor and two highly integrated, software-programmable driver chips designed for satellite architectures.
TI held a media conference on the 23rd and introduced new semiconductors designed to improve vehicle safety and intelligence.
The AWR2544 77GHz millimeter wave (mmWave) radar sensor chip is the industry’s first satellite radar architecture that improves sensor fusion and decision-making capabilities in ADAS to enable higher levels of autonomy.
Many automakers are adding more and more sensors to their vehicles to improve safety and autonomy.
In satellite architecture, radar sensors provide 360-degree omnidirectional sensor coverage and output semi-processed data to the central processor through sensor fusion algorithms for ADAS decision-making, achieving a high level of vehicle safety.
Additionally, the AWR2544 single-chip radar sensor is the industry’s first to feature Launch-on-Package (LOP) technology.
LOP technology mounts a 3D waveguide antenna on the opposite side of a printed circuit board.It can reduce sensor size by up to 30% and extend sensor range to more than 200m with a single chip.
Automakers can leverage these capabilities in satellite architectures to enhance ADAS intelligence, enabling greater levels of vehicle autonomy and more intelligent decision-making from greater distances.
The AWR2544 is the latest addition to TI's radar sensor portfolio, designed for corner, forward, imaging, side and rear radar systems, supporting a broad range of ADAS applications and architectures.
TI's new software-programmable driver chips, the DRV3946-Q1 integrated contactor driver and the DRV3901-Q1 pyrofuse integrated squib driver, provide built-in diagnostic capabilities and support functional safety for battery management and powertrain systems.
The SDV trend presents designers with the design challenge of developing smarter and more advanced battery management systems (BMS).
Two new highly integrated, software-programmable driver chips from TI address the need for safer, more efficient control of high-voltage shutdown circuits in BMS or other powertrain systems.
Both drivers meet the International Organization for Standardization (ISO) 26262 functional safety standard and have built-in diagnostic and protection features that can shorten vehicle development times.
The DRV3946-Q1 for BMS and other powertrain systems is the industry's first fully integrated contactor driver.
It includes a peak-and-hold current controller that helps automakers improve system power efficiency and allows safety diagnostics to monitor contactor health.
/> TI's DRV3901-Q1 fully integrated squib driver monitors pyro fuses and communicates diagnostic information to the system microcontroller via on-chip circuitry to implement an intelligent pyro fuse tripping system.
This approach gives hybrid electric vehicle and electric vehicle BMS engineers the flexibility to utilize pyrofuses as a replacement for conventional melting fuse systems while minimizing design complexity.
“Semiconductor innovations like the new products unveiled at CES this year support the continued advancement of automotive systems and help provide drivers with a safer experience,” said Brandon Seiser, TI automotive ADAS radar product marketing manager, who made the announcement that day.
“TI is working with automakers to create safer vehicles with more reliable and innovative technologies, from more advanced driver assistance systems to smarter electric vehicle powertrain systems,” said Mark Ng, general manager of the Hybrid and Electric Vehicle Business Group, who also made the presentation.