인텔(Intel)이 상하이 모터쇼 2025에서 업계 최초로 멀티-공정 노드 칩렛 아키텍처를 적용한 2세대 인공지능(AI) 강화 소프트웨어 정의 차량(SDV) SoC를 공개했다. 이 신형 SoC는 지능형 커넥티드 차량에 대한 수요 증가에 발맞춰 설계됐으며, 완성차 업체에 확장가능한 성능, 첨단 AI 기능, 비용 효율성을 제공한다.
▲Jack Wistfallow, general manager of Intel Automotive, is giving a presentation at the Shanghai Motor Show 2025 event.
AI performance up to 10x better, graphics performance up to 3x better
Model Best and Black Sesame Collaboration Immersive User Experience
Intel accelerates software-defined vehicle (SDV) innovation with next-generation SoCs and partnerships.
At Auto Shanghai 2025, Intel unveiled its second-generation artificial intelligence (AI)-enhanced software-defined vehicle (SDV) SoC featuring the industry’s first multi-process node chiplet architecture.
This new SoC is designed to address the growing demand for intelligent, connected vehicles, providing automakers with scalable performance, advanced AI capabilities, and cost efficiency.
“Intel’s second-generation SDV SoC redefines the paradigm of automotive computing, combining the flexibility of chiplet technology with Intel’s proven holistic vehicle approach to make SDV innovation a reality,” said Jack Weast, general manager, Intel Automotive.
This SoC allows automakers to flexibly configure computing, graphics, and AI functions, reducing development costs and shortening product launch times.
Looking at the main performance improvement factors, AI performance has improved by up to 10 times, and graphics performance has improved by up to 3 times. It also supports 12 camera lanes to enhance camera input and image processing capabilities.
These innovative designs enable automakers to deliver next-generation user experiences while optimizing power consumption and costs.
Intel also announced strategic collaborations with ModelBest and Black Sesame Technologies at the event.
ModelBest implements AI voice control and customized cockpit experiences based on Intel's SDV SoC and Intel® Arc™ graphics.
BlackSesame Technologies is combining Intel’s SDV SoC with automotive-grade Intel Arc graphics to unify ADAS and immersive cockpit experiences onto a single central compute platform.
This collaboration will accelerate in-vehicle AI innovation and provide a seamless user experience.
Intel is making the SDV era a reality by enhancing various elements such as energy efficiency, software scalability, and immersive user experiences.
This announcement marks a significant milestone for Intel’s automotive business, demonstrating its vision to deliver powerful compute performance and flexibility for future mobility.
.jpg)
