AI Semiconductor Power Ratio Securing, Proven Through Butter Heat Test
Raspberry Pi~Hyperscale Datacenter Compatibility Proven
DeepX will unveil its AI semiconductor technology achievements in the global market and commercialization results through collaboration with customers in Korea.
DeepX, an AI semiconductor source technology company, announced on the 14th that it will participate in the '2024 Semiconductor Expo', the largest semiconductor exhibition in Korea, held at COEX in Seoul.
We will conduct a butter heating test where you can experience low-power ultra-gap technology firsthand. Through this unique heating test, visitors can intuitively confirm low-power performance by seeing butter, which melts at human body temperature, not melting on the DX-M1 silicon even during AI calculation processing.
DeepX's total AI solution features a wide range of compatibility that can be expanded from single-board computers such as Raspberry Pi to hyperscale data centers. In particular, the server-grade product DX-H1 PCIe module succeeded in running the latest object recognition AI algorithm in real time on over 100 channels in collaboration with global server companies HP and K2US.
We will also present various real-time demos applicable to smart cameras, robot platforms, industrial embedded systems, servers, and data centers based on this.
Starting with CES in the US early this year, DeepX participated in major global exhibitions such as MWC in Europe in February, Secutech Taipei in Taiwan in April, Computex Taipei in Taiwan in June, AI Hardware Summit in the US in September, and Embedded World in the US in October, accelerating the establishment of a global position as a leading on-device AI semiconductor company.
Accordingly, joint promotions are being carried out with global companies in Taiwan, China, Japan, Europe, the United States, etc. It is reported that the company has currently provided its hardware and software in prototype form to about 120 global companies and is currently collaborating with more than 20 companies on the development of mass-produced products.
At this exhibition, where companies related to the domestic semiconductor ecosystem are all participating, DeepX will present a real-time demo of the latest AI model, the Vision Language Model (VLM), running on-device and in multi-channel through collaboration with leading global IPC (Industrial PC) product companies using the DX-M1 M.2 module. This model supports solutions that understand dangerous situations such as electric vehicle fires or crowds in real time and automatically issue alarms.
DeepX is currently in the first-generation mass production stage and is providing customized solutions that respond to various standard interfaces and application requirements required by customers. Mass production development is expected to take place with about 10 global companies in the second half of this year, and it is expected to expand to more than 20 customers by the first half of next year.